MISCELLANEOUS
4.34x4.34mm MCU combines cryptography,
secure key storage and tamper detection
Offered in a 4.34x4.34mm wafer-level package, Maxim’s
MAX32558 DeepCover IC secure microcontroller is claimed to
be 50% smaller than
the nearest competitor.
The MAX32558
DeepCover Arm
Cortex-M3 flashbased
secure microcontroller
delivers
strong security in a
small footprint while
simplifying design
integration and speeding time to market. It integrates several
security features into a small package, including secure key
storage, a secure bootloader, active tamper detection and
secure cryptographic engines. It also supports multiple communications
channels such as USB, serial peripheral interface
(SPI), universal asynchronous receiver-transmitter (UART) and
I2C, making it suitable for a wide range of applications. Compliant
with Federal Information Processing Standard (FIPS) 140-2
L3&4 certification, the chip reduces footprint by embedding a
number of security features specifically to address point-ofsale
Payment Card Industry (PCI) pin transaction security (PTS)
requirements, as well as several analog interfaces. It comes
with 512KB of internal flash and 96KB of internal SRAM. Complete
software framework including real-time operating system
(RTOS) integration and code examples in evaluation kit.
Maxim Integrated
www.maximintegrated.com
Distributed force array sensor
brings extra functionality to mobiles
The distributed force array (DFA) sensor uses Peratech’s
proprietary quantum tunnelling composite (QTC) technology
to provide an
array of single
point sensors
that can
be used in
conjunction
with a position
sensor (such
as capacitive)
to measure
force and correlate
it with
position. The
DFA sensor’s variable input force allows for additional, or new
functionalities, such as the ability to navigate device menus
and perform other operations via single-finger touch. The DFA
sensor also allows for correct haptic feedback when the force
reaches a pre-selected activation point, a feature that obviates
false touch situations. In multi-touch applications, the DFA’s
proportional force sensing feature can determine the ratio of
forces between presses (i.e. harder press to left or right), which
can have benefits in improved control, especially in gaming
applications. The distributed force array sensors are customizable,
cost effective and low power. They are delivered with
control electronics and software.
Peratech
www.peratech.com
Transformerless chipset enables
higher power density AC-DC converters
Using switching capacitors for power conversion, and by
transferring power across a capacitive isolation barrier, the
MxC 300 chipset released by Helix Semiconductors enables
the replacement of traditional transformers, which are bulky
and less efficient.
As a result, AC-DC power supplies up to 65W can realize up to
20x power density improvement over traditional transformerbased
architectures – with average efficiencies of greater than
94 percent. The MxC 300 chipset has already been adopted
by Murata who partnered with Helix Semiconductors for the
development of AC-DC converter modules.
Helix Semiconductors
www.helixsemiconductors.com
4-pin 0.4mm-pitch logic package
eases PCB assembly
Nexperia’s four pin X2SON4 package is what the company
says is the smallest logic package that can be used without
requiring an expensive
and fragile
step-down mask.
Therefore, PCB assembly
is quicker,
easier, more reliable
and more costeffective.
The X2SON
packages were
designed to provide
the smallest footprint
for logic functions while ensuring pad pitch remains 0.4mm or
over (step-down masks are only needed under that threshold).
The company’s low-power AUP, AXP, LV and LVC technology
families covering over one hundred logic solutions are now
available in X2SON 8, 6, 5 and 4-pin packages. The new 4-pin
X2SON4 package option reduces the footprint of the same
function by 44% when compared to 5-pin X2SON5, and by
up to 64% when compared to XSON packages. The larger
pad pitch provides greater contact area, resulting in easier
component placement, as well as improved joint strength and
robustness.
Nexperia
www.nexperia.com
www.eenewseurope.com eeNews Europe September 2018 News 47
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